Tool-less coupling assembly

ABSTRACT

Embodiments of the present invention overcome the deficiencies of the prior art by providing a tool-less, lever actuated, robust yet tolerant, high load delivery, low-profile component retention assembly for coupling components together. The assembly may include a plate and a lever coupled to the plate.

CROSS-REFERENCE TO RELATED APPLICATIONS

Not Applicable.

STATEMENT REGARDING FEDERALLY SPONSORED RESEARCH OR DEVELOPMENT

Not Applicable.

BACKGROUND

1. Field of the Invention

This disclosure generally relates to methods and apparatus for couplingcomponents to a circuit board.

2. Background Information

Conventionally, an electrical device (e.g., a processor) is mounted in asocket on a printed circuit board that includes a plurality ofintegrated circuits secured thereto. Heat dissipation may affect theoperation of the processor and thus it is desirable to have a highlyeffective heat sink for the processor to remove heat generated by theprocessor. Heat sinks are often attached to the processors/circuitboards by way of thermally conductive epoxy/tapes, a spring-based metalclip, plastic devices, or spring/screw combinations.

The use of thermally conductive epoxy to mount a heat sink onto thesurface of a printed circuit board may be a significantly complexmanufacturing procedure thereby increasing the overall cost andcomplexity of manufacturing. For example, there may be a considerablelevel of difficulty to depositing an epoxy layer of uniform thicknessbetween the circuit board and the heat sink. The heat sink and thecircuit board must be pressed together with a certain amount of pressurefor a certain amount of time and in a certain orientation. Failure tocontrol these variables (pressure, time, and orientation) carefully mayprevent proper operation of the heat sink. Furthermore, an effectivetechnique to easily separate the heat sink from the processor once theinterface has been heated is not known to exist.

As an alternative to epoxy, a spring-based metal clip can be used toretain the heat sink on the circuit board by snapping onto a BGA socketor edge of an ASIC interposer. Such a clip, however, creates asignificant drawback. Specifically, the bowed configuration of thespring-based clip causes a large portion of the clip to protrude abovethe top surface of the heat sink taking away valuable fin surface area.Furthermore, in high power processor applications, the heat sinkrequired for a given processor may have a much larger footprint than theprocessor itself. This need for such large heat sinks makes the use ofwire clips incapable of supporting these heavy objects and puts highstresses on soldered joints.

A third mechanism for attaching heat sinks to processors/circuit boardsincludes using plastic components to hold the heat sink in place forthermal compression and structural constraint. Although plastics arebeneficial due to their electrical insulation, they are inadequate forsustaining the forces and high temperatures associated with heat sinksused on high powered processors due to inevitable creep, reducing theireffectiveness and potential catastrophic failure.

Finally there is a majority of systems designed that incorporate screwsand springs combined with standoffs and/or brace structures to mount theheat sinks to the system. Apart from providing a structurally soundsolution this design path is disastrous due volume of loose parts totrack, assemble and properly tighten. One of the most significantdrawbacks is the fact that a tool is required to perform installation orservice.

With some heat sinks, the processor is installed into a socket on thecircuit board and retained in place by a locking mechanism that may beintegral to the socket. Processors may be installed onto a socket byhand and it is up to the installer to ensure proper alignment of theprocessor pins with the holes on the socket. Once the processor isinstalled, the heat sink is then affixed to the top of the processor bya thermally conductive interface. The size of the heat sink may be largeenough to prevent unlocking and removing of the processor while the heatsink is installed. In these situations, the heat sink must be removedfrom the processor before the processor can be removed from the socket.

Therefore, there remains a need in the art for methods and apparatusthat allow for heat sinks to be installed and uninstalled from aprocessor or other electrical device without the need for special reworkinstructions or tools, and performed in an intuitive, user friendly,easy manner. If a large heat sink is intended to be used and that heatsink size in turn requires a large force to hold it in place forshipping, there remains a need for a lever to provide mechanicaladvantage to apply that load. Furthermore, due to the large number oftolerance variations in PCBs, soldered joints, ASIC package heights,etc. there remains a need for a device that can be compliant and acceptthese variations while still providing equal load distribution.

BRIEF SUMMARY

Embodiments of the present invention include a tool-less retentionassembly for coupling components together. The assembly may comprise aplate and a lever coupled to the plate.

BRIEF DESCRIPTION OF THE DRAWINGS

For a more detailed description of the embodiments of the presentinvention, reference will now be made to the accompanying drawings,wherein:

FIG. 1 shows an exploded schematic representation of a tool-less leveractuated assembly in accordance with embodiments of the invention;

FIG. 2 shows a tool-less lever actuated heat sink assembly in accordancewith other embodiments of the invention;

FIGS. 3A and 3B include schematic representations of the assembly ofFIG. 1 in unlocked and locked positions in accordance with embodimentsof the invention;

FIG. 4 illustrates a schematic representation of a screw jack orinclined plane in accordance with embodiments of the invention;

FIGS. 5A and 5B show schematic representations of the assembly of FIG. 2in locked and unlocked positions in accordance with embodiments of theinvention;

FIG. 6 shows a schematic representation of a cam lever in accordancewith embodiments of the invention;

FIGS. 7A and 7B show schematic representations of an assembly inunlocked and locked positions in accordance with embodiments of theinvention; and

FIG. 8 shows a block diagram of a computer system in accordance withembodiments of the invention.

NOTATION AND NOMENCLATURE

Certain terms are used throughout the following description and claimsto refer to particular system components. As one skilled in the art willappreciate, computer companies may refer to a component by differentnames. This document does not intend to distinguish between componentsthat differ in name but not function. In the following discussion and inthe claims, the terms “including” and “comprising” are used in anopen-ended fashion, and thus should be interpreted to mean “including,but not limited to . . . .” The term “couple” or “couples” is intendedto mean either an indirect or direct electrical connection. Thus, if afirst device couples to a second device, that connection may be througha direct electrical connection, or through an indirect electricalconnection via other devices and connections. Also, the term “board” maybe used to refer to a printed circuit board or any type of structure towhich components are mounted and interconnected.

In the description that follows, like parts are marked throughout thespecification and drawings with the same reference numerals,respectively. The drawing figures are not necessarily to scale. Certainfeatures of the invention may be shown exaggerated in scale or insomewhat schematic form and some details of conventional elements maynot be shown in the interest of clarity and conciseness.

DETAILED DESCRIPTION OF EMBODIMENTS OF THE INVENTION

The following discussion is directed to various embodiments of theinvention. Although one or more of these embodiments may be preferred,the embodiments disclosed should not be interpreted or otherwise used aslimiting the scope of the disclosure, including the claims, unlessotherwise specified. In addition, one skilled in the art will understandthat the following description has broad application, and the discussionof any embodiment is meant only to be exemplary, and not intended tointimate that the scope of the disclosure, including the claims, islimited to these embodiments.

There are shown in the drawings, and herein will be described in detail,various embodiments of the invention with the understanding that thedisclosure is to be considered merely an exemplification of theprinciples of the invention, and is not intended to limit thisdisclosure including the claims to those embodiments illustrated anddescribed herein.

Referring initially to FIG. 1, an exploded view of a tool-lesslever-actuated heat sink retention assembly 10 in accordance withembodiments of the invention is shown along with a heat sink 40, aprocessor 44, and a circuit board 46, collectively referred to as heatsink/processor/circuit board assembly 30. Referring now to FIGS. 1, 3Aand 3B, retention assembly 10 may include a pronged plate 12 and afastener 22. Fastener 22 may comprise any structure having a threadedportion, such as a screw. Retention assembly 10 may also include atorque-limiting device such as a brake or spring (not shown).Torque-limiting devices may be used to prevent over-tightening offastener 22. In some embodiments, fastener 22 may comprise atorque-limiting device, where the fastener 22 is a torque thumbfastener.

Pronged plate 12 may have countersinks 14 to receive pins 42 a, 42 b and42 c from a heat sink 40. In some embodiments, countersinks 14 areconnected to tear drop shaped channels 16, which may act to funnel pins42 into countersinks 14. Pronged plate 12 may have a hole 18 withthreads 19 for receiving the threaded shank 24 of fastener 22. Prongedplate 12 may be fabricated from a suitable metal, such as stainlesssteel.

In some embodiments, pronged plate 12 may be formed generally into a “Y”shape as shown. Additionally, in some embodiments, pronged plate 12 maybe keyed. A keyed installation may help to ensure that the user does notincorrectly install the pronged plate 12.

In addition, when a “Y” shaped pronged plate 12 is used, it may bedesirable to vary the widths W of the prongs 15, remove a predeterminedmaterial section 17 from the prongs 15, or a combination of both to helpensure equal loading on the plate. For some embodiments, simulationssuch as finite element analysis (FEA) may be performed in order todetermine stresses, deflections, and resulting loads in accordance withknown or customized techniques. The information obtained from suchsimulations may then be used to adjust the dimensions of pronged plate12 to ensure equal loading on the plate.

Fastener 22 may include a shank 24, a head 26, and a lever 28. Asexplained above, shank 24 may have threads 25 for threadingly engagingthreads 19 in pronged plate 12. Lever 28 may allow the user to adjustthe load, by twisting the lever.

Referring now to FIGS. 2, 5A and 5B, a tool-less lever actuated heatsink retention assembly 50 is shown in accordance with otherembodiments. Retention assembly 50 may include a pronged plate 52, a camlever 62, and an axle 72. Because the pronged plate 52 of FIG. 2 hassimilar requirements to the pronged plate 12 of FIG. 1, it will not bediscussed in further detail, except to mention that pronged plate 52 mayhave at least two receiving portions 58 for receiving axle 72 and maynot have a hole with threads for receiving the shank of a fastener.

Cam lever 62 may include a cam portion 64 and a lever portion 66. Camportion 64 rotates around axle 72, which may connect to pronged plate 52via receiving portions 58 and biased to pronged plate 52 by one or moresprings 74 (or other biasing devices) wrapped around, or otherwisecoupled to, axle 72. In some embodiments, the ends (not shown) of axle72 are flanged in order to keep axle 72 within receiving portions 58. Insome embodiments, a first portion 75 of spring 74 may be engaged againstplate 52 and a second portion 76 of spring 74 may be engaged against camlever 62.

Referring now to FIGS. 7A and 7B, a tool-less lever actuated heat sinkretention assembly 100 is shown in accordance with yet otherembodiments. Retention assembly 100 may include a pronged plate 110, alever mount 120, a lever arm 130, and a plurality of movable arms 140.Pronged plate 110 may include a plurality of slots (not shown) forreceiving pins 42 a,b,c,d from heat sink 40, a threaded hole (not shown)for receiving a fastener 150, and a plurality of connector pins 118.

Lever mount 120 may be attached to pronged plate 110 via fastener, orguidepost, 150. Fastener 150 may comprise any structure having athreaded portion (not specifically shown), such as a screw. Fastener 150may be received into a threaded hole (not shown) in pronged plate 110.

Arms 140 may be connected to both lever mount 120 and pronged plate 110.In some embodiments, arms 140 connect to lever mount 120 via rolled overstakes 142, creating a pivoting hinge 143. Arms 140 may be connected topronged plate 110 via connector pins 118. A portion of each connectorpin 118 may be embedded in pronged plate 110 and the end or “headportion” 119 may be received into a slot 148 in arms 140. In someembodiments, slot 148 may be crescent or equivalent shaped.

Arms 140 may also have countersinks 144 to receive pins 42 a, 42 b, 42c, 42 d from heat sink 40. In some embodiments, countersinks 144 connectto tear drop shaped channels 146, which act to funnel pins 42 intocountersinks 144. The ends 141 of arms 140 may be inclined.

In some embodiments, pronged plate 110 may be formed generally into an“X” shape as shown. The ends 112 of pronged plate 110 may be inclined tocoincide with the ends 141 of arms 140 to provide lifting action as thearms 140 slide over plate 110 during rotation of lever 130.Additionally, in some embodiments, pronged plate 110 may be keyed. Asexplained above, a keyed installation helps to ensure that the user doesnot incorrectly install the pronged plate 110. Plate 110 may also havean adhesive backing combined with a covering 35 to secure it to thecircuit board 46 to provide a permanently attached solution for the userand protect the PCA components and user from possible damage duringactuation.

Operation

FIGS. 3A and 3B show the tool-less lever actuated heat sink retentionassembly 10 in locked and unlocked positions, respectively. In order toinstall retention assembly 10 in the locked position, the followingactions may be performed. Referring back to FIG. 1, the pronged plate 12may be placed under the heat sink/processor/circuit board assembly 30such that pins 42 projecting from the heat sink 40 may be received inteardrop shaped channels 16 of plate 12. Pronged plate 12 may beadjusted so that pins 42 are pushed into countersinks 14 at the ends ofteardrop shaped channels 16. In some embodiments, pins 42 hold prongedplate 12 into the desired position, which forces pronged plate 12 tobow, or deflect, in the center of the plate.

Simply by way of further understanding and without limitation, theinitial deflection and loading on pins 42 from pronged plate 12 may besimilar to those exhibited in a cantilever, whose deflection δ, ismodeled with the following equation: $\begin{matrix}{\delta = \frac{{EFbt}^{3}}{4L^{3}}} & (1)\end{matrix}$where: δ=deflection

E=modulus of elasticity

F=force in cantilever

b=width of plate

t=thickness of plate

L=length of plate

Assuming, for example and without limitation, that the user is trying toimpose a 40 lb. load on the heat sink by hand, approximately 20 lbs. maybe placed on the single pin 42 a and approximately 10 lbs. may be placedon each of the other two pins 42 b,c. Per equation (1) above, thecalculated deflection δ is approximately 0.10″. Therefore, with respectto the embodiment of FIGS. 3A and 3B, the fastener 22 must be tightenedso that the center of the heat sink 40 is lifted 0.10″ to apply theforce F on the pins 42.

Once the pins 42 are in place, the user may twist the lever 28 offastener 22 so that threads 25 of the fastener 22 threadingly engagewith the threads 19 of pronged plate 12. The user may twist lever 28until a desired load is achieved. As described above, for a 40-lb. load,the fastener 22 must be tightened so that the center of the heat sink 40is lifted 0.10″. In some embodiments, the load is distributed evenlyacross the pins 42.

In order to unlock the retention assembly 10, the user twists lever 28in the opposite direction until loading is reduced enough so as to beable to remove the heat sink. The fastener 22 preferably acts as a screwjack, which is used to overcome a heavy pressure or raise a heavy weightW of by a much smaller force F applied at the lever 28.

FIG. 4 shows the mechanics behind a screw jack 80. R represents thelength of the lever 84 and P the pitch of the fastener 82, or thedistance advances in one complete turn. Neglecting friction, thefollowing rule is used: The force F applied to the fastener lever 84 inthe clockwise direction multiplied by the distance through which itmoves in one complete turn is equal to the weight lifted times thedistance through which it is lifted in the same time. In one completeturn, the end 85 of the lever 84 moves through the circumference of acircle—the circumference is 2ΠR. This is the distance through which theforce F is exerted.

Therefore from the rule above:F×2ΠR=W×P  (2)and $\begin{matrix}{F = \frac{W \times P}{2\pi\quad R}} & (3)\end{matrix}$

By way of example, suppose R equals 1 in., P equals {fraction (1/10)}in. and the weight to be lifted equals 40 lb., then the force requiredat F is approximately 0.64 lb. Notice that the calculated deflection δfrom above is equal to the pitch P of the fastener. This means that,neglecting friction, 0.64 lb. at F will raise 40 lb. at W in onecomplete turn of the fastener, but the weight lifted moves much slowerthan the force applied at F.

The stress of the pronged plate 12 may be calculated by the followingequation: $\begin{matrix}{S = \frac{{EFt}^{3}}{2L^{2}}} & (4)\end{matrix}$where: S=Stress

E=modulus of elasticity

F=force in cantilever

t=thickness of plate

L=length of plate

By using a material thickness having a stress that is a fraction of themaximum of the full hard material, the user is afforded designflexibility for higher loading with a safety factor.

The cantilever model is how the heat sink-processor-circuitboard-retention assembly generally operates. However, when a shock isexperienced by the assembly, the tips of the prongs 15 of the prongedplate 12 may come in contact with the circuit board 46. This changes theloading from a cantilever to a simple beam. In this case, thedeflection, δ, may be modeled as: $\begin{matrix}{\delta = \frac{4{EFbt}^{3}}{L^{3}}} & (5)\end{matrix}$where: δ=deflection

E=modulus of elasticity

F=force in beam

b=width of plate

t=thickness of plate

L=length of plate

The simple beam model allows for 16× the load given the material andmechanical constraints. As a result, the user can apply relatively heavyloads to the heat sink/processor/circuit board/retention assemblywithout fear of moving the heat sink or damaging the processor. Inaddition, in the simple beam model, any further deflection maytransition the pronged plate 12 to be flat against the circuit board 46(locally to the pin 42) and, in essence, creates an immovable layer ofmetal resistant to heavy forces.

FIGS. 5A and 5B show the tool-less lever actuated heat sink retentionassembly 50 in locked and unlocked positions. In order to installretention assembly 50 in the locked position, the following actions maybe taken. Referring back to FIG. 2, the pronged plate 52 may be placedunder the heat sink/processor/circuit board assembly 30 such that pins42 projecting from the heat sink 40 are received in teardrop shapedchannels 56 of plate 52. Pronged plate 52 may then be adjusted so thatpins 42 are pushed into countersinks 54 at the ends of tear drop shapedchannels 56. Pins 42 have the same calculated deflection δ as above(approximately 0.10″).

Once the pins are in place, the lever portion 62 may be rotated aboutaxis 72 so that it is flush with pronged plate 52. During this maneuver,the cam portion 64 is rotated around axle 72. The cam portion 64 placesa load off center (eccentric) from axle 72, forcing lever portion 62 tostay in a locked position.

In some embodiments, a covering 35 may be placed between retentionassembly 50 and circuit board 46. The covering 35 may be preferablyfabricated from a non-conducting material such as plastic. When acovering 35 is used, a slot 59 may be notched in lever portion 62 thataligns with an “ant hill” protrusion (not shown) in the covering 35. Thealignment of slot 59 and the protrusion give the user feedback ifinstallation is not correct by not allowing the lever 62 to lay flushwith plate 52.

In order to unlock the retention assembly 50, the user simply pulls androtates lever portion 62 in the opposite direction, forcing the camportion 64 to push against the circuit board 46 and reduce loading toapproximately zero. The torsional spring 74 provides resistance againstlever portion 62, forcing it to stay in an unlocked position, which aidsthe user by placing the lever portion 62 in the correct orientation forsubsequent uses.

FIG. 6 illustrates the mechanics behind cam lever 90. R_(C) represents alength of the cam C that rotates about pivot P, and R_(L) represents thelength of the lever L. Neglecting friction, the following rule is used:The weight W to be lifted multiplied by cam length R_(C) is equal to theforce F needed to raise weight W multiplied by lever length R_(L)(assuming the force is applied at the end of lever L). Therefore:

 W×R _(C) =F×R _(L)  (6)

and $\begin{matrix}{F = \frac{W \times R_{C}}{R_{L}}} & (7)\end{matrix}$

Suppose the weight W to be lifted is again 40 lbs., R_(C) is equal to 1cm, and R_(L) is equal to 8 cm, then the force required at F isapproximately 5 lbs.

Referring back to FIGS. 7A and 7B, the tool-less lever actuated heatsink retention assembly 100 is shown in unlocked and locked positions,respectively. In order to install retention assembly 100 in the lockedposition, the following steps may be performed. Similar to the first twoembodiments, the pronged plate 110 may be placed under the heatsink/processor/circuit board assembly 30 such that pins 42 a, 42 b, 42c, 42 d projecting from the heat sink 40 are received into the slots(not shown) of pronged plate 110 and teardrop shaped channels 146 ofarms 140. Lever arm 130 may be pushed so that lever mount 120 rotates ina clockwise manner. Fastener, or guidepost, 150 properly translates therotational movement of lever arm 130 and lever mount 120 into thetranslational movement of arms 140.

Arms 140 may be adjusted so that pins 42 are pushed into countersinks144 at the ends of tear drop shaped channels 146. In some embodiments,pins 42 may hold arms 140 into the desired position, which push againstpronged plate 110, and force arms 140 to deflect. The deflection of arms140 may be similar to a wedge-like action, where arms 140 are pushedunder pins 42 and the load is distributed according to simple beamequation (5).

The various embodiments of retention may be used, for example, in acomputer system, such as that illustrated in FIG. 8. Referring now toFIG. 8, an embodiment of a computer system 155 is shown. Computer system155 may include any of a variety of components such as a processor 160,memory 170, and an input/output device 180 (e.g., a keyboard, mouse,trackball, etc.). Retention assembly 190 (in accordance with any of theembodiments of the invention) may be used in conjunction with theprocessor 160.

While embodiments of the invention are susceptible to variousmodifications and alternative forms, specific embodiments thereof areshown by way of example(s) in the drawings and associated description.It should be understood, however, that the drawings and detaileddescription are not intended to limit the claims to the particular formdisclosed, but on the contrary, the intention is to cover allmodifications, equivalents and alternatives falling within the spiritand scope of the present invention as defined by the appended claims.For example, this disclosure is not limited to heat sinks andprocessors. In general, the retention clip can be used to couple any twocomponents together in a computer system or in other systems. Also, theretention clip may be temporarily or permanently used to couple thecomponents.

1. A tool-less retention assembly for coupling a first component to asecond component, comprising: a plate having countersinks; and a levercoupled to said plate, wherein movement of said lever allows a user toimpose a predetermined load on the assembly such that the plate is incontact with a first component and wherein said plate is capable ofreceiving pins from a second component through said countersinks.
 2. Theassembly, according to claim 1, wherein said lever is located on afastener having a threaded shank and said plate having a hole forthreadingly engaging said fastener.
 3. The assembly according to claim 2wherein said plate includes channels for receiving the pins.
 4. Theassembly according to claim 2 wherein said plate comprises a prongedplate.
 5. The assembly according to claim 4 wherein the prongs of saidplate have varied widths.
 6. The assembly according to claim 2 whereinsaid fastener includes a handle.
 7. The assembly according to claim 2further comprising a torque-limiting device that prevents theover-tightening of said fastener.
 8. The assembly according to claim 2wherein said first component comprises a printed circuit board, whereinsaid second component comprises a heat sink, and wherein a processor ismounted on said printed circuit board and is held in place by said heatsink.
 9. The assembly, according to claim 1, further comprising: anaxle, wherein said lever comprises a cam lever that rotates around saidaxle; and said plate has a receiving portion for engaging said axle. 10.The assembly according to claim 9 wherein the ends of said axle areflanged.
 11. The assembly according to claim 9 wherein a spring iswrapped around said axle.
 12. The assembly according to claim 11 whereina first portion of said spring is engaged against said plate and whereina second portion of said spring is engaged against said cam lever. 13.The assembly according to claim 9 wherein said first component is aprinted circuit board, wherein said second component is a heat sink, andwherein a processor is mounted on said printed circuit board and is heldin place by said heat sink.
 14. The assembly according to claim 9further comprising a covering located between said plate, cam lever andsaid printed circuit board.
 15. The assembly according to claim 14wherein said covering is fabricated from a non-conductive material. 16.The assembly according to claim 14 wherein said covering includes aprotrusion and wherein said cam lever includes a slot for alignment withsaid protrusion in the covering.
 17. An assembly, comprising: anintegrated circuit; a heat sink; a circuit board to which saidintegrated circuit and heat sink mate; and a heat sink retention clipcomprising: an axle; a cam lever that rotates around said axle; a platehaving a receiving portion for engaging said axle; wherein said camlever and plate are in contact with said circuit board, wherein saidplate has countersinks to receive pins from said heat sink, and whereinsaid chip is mounted on said circuit board and is held in place by saidheat sink.
 18. A method of installing and retaining a heat sink onto anintegrated circuit mounted to a circuit board, the method comprisingsteps: (1) placing the heat sink on top of the integrated circuit; (2)inserting alignment pins that are mounted to the heat sink intoreceptacles located on the top of the circuit board; (3) placing a heatsink retention clip on the bottom of the circuit board, wherein thealignment pins are received into countersinks of the clip; and (4)locking the clip.
 19. The method of claim 18 wherein the method isperformed without any tools.
 20. A computer system, comprising: aprocessor; memory; an input/output device; and a retention assemblycomprising: a plate; and a lever in communication with said plate,wherein movement of said lever provides a mechanical advantage thatallows a user to impose a predetermined load on said retention assemblysuch that said plate is in contact with a first side of a firstcomponent and applies a load to a second component that is disposed on asecond side of the first component.
 21. A tool-less retention assemblyfor coupling a first component to a second component, comprising: aplate; and a means for imposing a predetermined load on the assemblysuch that the plate is in contact with a first component and whereinsaid plate is capable of receiving pins from a second component, whereinthe first component is positioned between the second component and saidplate.
 22. A heat sink retention assembly comprising: a plate disposedon a first side of a circuit board; a plurality of prongs extending froma center portion of said plate, wherein at least one of said pluralityof prongs attaches to a pin that is connected to a heat sink disposed ona second side of the circuit board; and a lever coupled to said plate,wherein movement of said lever urges the heat sink toward the circuitboard.
 23. The heat sink retention assembly of claim 22, wherein saidlever comprises a fastener having a threaded shank, wherein said platethreadingly engages the fastener.
 24. The heat sink retention assemblyof claim 22, wherein said lever comprises a cam lever that rotatesaround an axle mounted to said plate.
 25. The heat sink retentionassembly of claim 24, further comprising a spring wrapped around saidaxle.
 26. The heat sink retention assembly of claim 25, wherein a firstportion of said spring is engaged against said plate and wherein asecond portion of said spring is engaged against said cam lever.
 27. Anassembly comprising: a circuit board having a first side and a secondside; a processor coupled to the second side of said circuit board; aheat sink disposed adjacent to the second side of said circuit board; aplurality of pins attached to said heat sink and extending through saidcircuit board; a plate disposed adjacent to the first side of saidcircuit board; a plurality of prongs extending from a center portion atsaid plate, wherein said plurality of prongs connects to said pluralityof pins; and a lever coupled to said plate, wherein movement of saidlever urges said heat sink toward said circuit board.
 28. The assemblyof claim 27, wherein said lever comprises a fastener having a threadedshank that engages said plate.
 29. The assembly of claim 27, whereinsaid lever comprises a cam that rotates relative to said plate.